发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a light emitting diode package achieving uniform light intensity and excellent color rendering properties.SOLUTION: A light emitting diode package according to the present invention includes: a substrate; an electrode structure installed on the substrate; a short wavelength light emitting diode chip and a long wavelength light emitting diode chip which are connected to the electrode structure; and a lens covering the short wavelength light emitting diode chip and the long wavelength light emitting diode chip. The lens includes: a converging portion for converging light, formed on an optical path of the long wavelength light emitting diode chip; and a diverging portion for diverging light, formed on an optical path of the short wavelength light emitting diode chip.
申请公布号 JP2013140969(A) 申请公布日期 2013.07.18
申请号 JP20120282449 申请日期 2012.12.26
申请人 ADVANCED OPTOELECTRONIC TECHNOLOGY INC 发明人 LIN HSIN CHIANG
分类号 H01L33/58 主分类号 H01L33/58
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