发明名称 |
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surfaceand the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive.
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申请公布号 |
US2013181343(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
US201213653727 |
申请日期 |
2012.10.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN JUNG-SEOK;KIM SANG-WON;CHO YOUNG-SANG;CHOI KWANG-CHUL;PYO SUNG-EUN |
分类号 |
H01L21/78;H01L23/498 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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