SOLDER BUMP FORMATION METHOD

摘要

PROBLEM TO BE SOLVED: To form fine size solder bumps on a substrate without providing a screen mask.SOLUTION: A solder bump formation method according to one embodiment of this invention comprises the steps of: forming guide layers on a substrate where a metal part and a dielectric layer defining the metal part are formed; conducting first application of a solder formation material, formed by mixing solder powder with a resin, to a space between the guide layers; removing the guide layers; heating the solder formation material to condense the solder powder on the metal part; removing the resin applied in the first application and the solder powder that is not condensed on the metal part; conducting second application of the resin on the substrate where the solder powder is condensed and then heating the substrate; and removing the resin applied in the second application.