发明名称 |
SYSTEMS AND METHODS OF PROCESSING SUBSTRATES |
摘要 |
<p>Some embodiments provide methods of processing wafers comprising: positioning a stacked wafer into a position to be ground, wherein the stacked wafer comprises a first wafer secured with a carrier-wafer, wherein the first wafer is secured with the carrier-wafer such that a surface of the first wafer is exposed to be ground; initiating a grinding of the first wafer while supported by the carrier-wafer; activating one or more sensors relative to the first wafer while grinding the first wafer; determining, while grinding the first wafer, a thickness of the first wafer separate from a thickness of the carrier-wafer as a function of data from the one or more sensors; determining whether the determined thickness of the first wafer has a predefined relationship with a first thickness threshold; and halting the wafer grinding when the thickness of the first wafer has the predefined relationship with the first thickness threshold.</p> |
申请公布号 |
WO2013106777(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
WO2013US21319 |
申请日期 |
2013.01.11 |
申请人 |
STRASBAUGH |
发明人 |
KALENIAN, WILLIAM J.;WALSH, THOMAS A.;VOGTMANN, MICHAEL R.;SMEDLEY, BENJAMIN C.;SPIEGEL, LARRY A.;BRAKE, THOMAS E. |
分类号 |
B24B49/04 |
主分类号 |
B24B49/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|