| 摘要 |
<p>A method and device for manufacturing a smart card inlay includes attaching a first and a second end of a single wire antenna to a single first substrate, fixing the wire antenna, aside from the first and second ends thereof, to a second substrate. The method further includes thereafter relocating the first substrate relative to the second substrate such that the first and second ends of the wire antenna are at locations on the second substrate suitable for connection to a chip module, thereafter connecting the first end and the second end to the chip module, and thereafter removing the first substrate.</p> |
