发明名称 Assembly for liquid cooling electronics by direct submersion into circulated engine coolant
摘要 An assembly for liquid cooling electronics by direct submersion into circulated engine coolant that includes an epoxy material dispensed around leads of electronics devices in a manner effective to mechanically secure the electronics devices to the assembly and prevent engine coolant leakage around the leads, and a Parylene(TM) coating layer deposited in a manner effective to protect the electronic device from electrically conductive engine coolant such as ethylene glycol. Such an assembly is useful in hybrid electric vehicles that have engine coolant available from the vehicle's internal combustion engine.
申请公布号 US8488321(B2) 申请公布日期 2013.07.16
申请号 US201113269656 申请日期 2011.10.10
申请人 BRANDENBURG SCOTT D.;PARKER RICHARD D.;LASHBROOK JOSEPH M.;DELPHI TECHNOLOGIES, INC. 发明人 BRANDENBURG SCOTT D.;PARKER RICHARD D.;LASHBROOK JOSEPH M.
分类号 H05K7/20;F28F7/00 主分类号 H05K7/20
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