| 摘要 |
<p>PURPOSE: An adhesive tape for dicing a semiconductor is provided to have excellent adhesion and surface energy and elasticity at room temperature, thereby improving pick up performance and minimizing chipping. CONSTITUTION: An adhesive tape for a semiconductor dicing comprises a base film (10), an adhesive film (20) formed on the base film, and a protection film (30) formed on the adhesive film. An adhesive composition is formed of a radiation curable resin composition. The radiation curable adhesive resin composition includes an acrylate base copolymer resin, a radiation polymerizable compound, a radiation polymerization additive, and a heat curable crosslinker. The heat curable crosslinker is selected from a polyisocyanate compound with 1-5 functional groups, an epoxy compound, and an aziridine compound.</p> |
