发明名称 LASER SOLDERING SYSTEM
摘要 PURPOSE: A laser soldering system is provided to divide laser beam by using a wedge substrate, thereby suppressing that the manufacturing cost of laser soldering system is suddenly soared. CONSTITUTION: A laser soldering system includes a wedge substrate (42), a wedge substrate driving control unit (82), and an intensity acquiring unit (50). The wedge substrate divides laser beam into a plurality of division laser beams. The wedge substrate driving control unit controls the incident amount of the laser beam for the wedge substrate by moving the wedge substrate in response to the laser beam. The intensity acquiring unit acquires the intensity of each division laser beam. The wedge substrate driving control unit moves the wedge substrate according to the intensity of each laser beam that is acquired from the intensity acquiring unit. [Reference numerals] (70) Memory unit; (72) Intensity ratio calculation unit; (74) Intensity ratio determination unit; (76) Temperature ratio calculation unit; (78) Temperature ratio determination unit; (80) Image determination unit; (82) Wedge substrate driving control unit; (84) Shutter control unit; (86) Camera unit controller; (88) Solder supply control unit
申请公布号 KR20130079148(A) 申请公布日期 2013.07.10
申请号 KR20120131168 申请日期 2012.11.19
申请人 MIYACHI CORPORATION 发明人 HIRAMATSU SHIGERU;WAKE KOICHI
分类号 B23K1/005;B23K26/00;H05K3/34 主分类号 B23K1/005
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