发明名称 Via structure
摘要 A via structure includes at least a first via set and a second via set electrically connected to the first via set. There is at least one via in the first via set and at least one via in the second via set. The via in the first via set has a cross-sectional area which is larger than that of the via in the second via set.
申请公布号 US8482131(B2) 申请公布日期 2013.07.09
申请号 US201113194986 申请日期 2011.07.31
申请人 IRELAND PHILIP J.;NANYA TECHNOLOGY CORP. 发明人 IRELAND PHILIP J.
分类号 H01L23/48 主分类号 H01L23/48
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