发明名称 |
LED light emitting apparatus and vehicle headlamp using the same |
摘要 |
Four LED chips are mounted on a sub-mount substrate so as to be parallel thereto. A wire 9a is installed to extend between a pad electrode 7a of two pad electrodes 7a, 7b provided in two diagonal corners of an upper surface of the LED chip 1 which pad electrode 7a is disposed on a first edge 1a side of the LED chip 1 and a bonding area of a conductive pattern 13 so as to be inclined at 15 to 40 degrees towards an orientation which moves away from a first edge 1a with respect to an orthogonal moving-away direction D relative to the first edge 1a. A wire 9b is installed to extend between the pad electrode 7b which is disposed on a second edge 1b side of the LED chip 1 and a bonding area of the conductive pattern 1 so as to be inclined 15 to 40 degrees towards an orientation which approaches a second edge 1b of the LED chip 1 with respect to an orthogonal moving-away direction D relative to the second edge 1b. |
申请公布号 |
US8482015(B2) |
申请公布日期 |
2013.07.09 |
申请号 |
US20100926637 |
申请日期 |
2010.12.01 |
申请人 |
HAKAMATA SHINTARO;MINATO TATSUYA;TOYODA GOSEI CO., LTD. |
发明人 |
HAKAMATA SHINTARO;MINATO TATSUYA |
分类号 |
H01L33/00;H01L23/48;H01L23/52;H01L27/15;H01L31/12 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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