发明名称 CONDUCTIVE FILM FORMATION METHOD, COPPER FINE PARTICLE DISPERSION LIQUID AND CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a conductive film formation method capable of forming a conductive film having low electrical resistance on a base material by utilizing optical burning even if heat resistance of the base material is low.SOLUTION: A conductive film formation method is a method for forming a conductive film 2 on a base material 1 and includes the steps of forming a coating film 3b made of copper fine particles 4 on the base material, optically burning the coating film 3b, and applying plating to an optically burned coating film 3c. As a result, the conductive film 2 can be formed on the base material 1 by reducing light irradiation energy in optical burning even if heat resistance of the base material is low. Since this conductive film 2 has a plating layer 21, its electrical resistance becomes low.
申请公布号 JP2013135089(A) 申请公布日期 2013.07.08
申请号 JP20110284611 申请日期 2011.12.27
申请人 ISHIHARA CHEM CO LTD;APPLIED NANOTECH HOLDINGS INC 发明人 KAWATO YUICHI;MITA MICHIHIRO;MAEDA YUSUKE;KUDO TOMIO
分类号 H05K3/12;H05K3/18 主分类号 H05K3/12
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