SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enable detection of whether cracks occur in a through electrode array region of a semiconductor chip even when the through electrode array region is formed at a position other than a periphery of the semiconductor chip.SOLUTION: A semiconductor chip comprises: a substrate; a plurality of substrate through electrodes 15 penetrating the substrate; and crack test wiring 18 connecting a first terminal DA and a second terminal VSS in response to a test signal. The crack test wiring 18 is arranged to pass between at least one substrate through electrode 15 of the plurality of substrate through electrodes 15 and a substrate through electrode adjacent to the at least one substrate through electrode 15 in plan view.