| 摘要 |
A LED die package includes an LED chip having a p-type electrode and an n-type electrode; an accommodating housing, for accommodating the LED chip, being made of transparent material and defining an accommodating space, an open end through which the accommodating space is accessible, a closed end opposite to the open end, and two through holes formed on a surface of the closed end, wherein the LED chip is mounted within the accommodating space, so that the p-type electrode and the n-type electrode of the LED chip are exposed via the trough holes; and a carrier having a conductor mounting surface and predetermined conductors formed on the conductor mounting surface, wherein the LED chip is mounted on the conductor mounting surface of the carrier, so that the respective electrodes thereof are electrically connected to predetermined conductors formed on the conductor mounting surface of the carrier via wires.
|
