METHOD OF MANUFACTURING CHIP PACKAGE MEMBER AND THE CHIP PACKAGE MEMBER

摘要

PURPOSE: A method for manufacturing a chip package member and the chip package member are provided to reduce the manufacturing costs of a smart IC chip package by forming a smart IC base member using polyethylene naphthalate with low costs. CONSTITUTION: A bonding layer (120) is formed on one side of an insulation layer (110) by coating an adhesive. The insulation layer is made of polyethylene naphthalate. The other side of the insulation layer is processed with plasma. A via hole (130) is formed on the insulation layer. A circuit pattern layer (142) is formed on the bonding layer. A plating layer (152) is formed on the surface of the circuit pattern layer in contact with the bonding layer.