| 摘要 |
PROBLEM TO BE SOLVED: To improve the performance of a semiconductor device.SOLUTION: A semiconductor chip 2 is mounted on a wiring board 3 so that a bump electrode 4 formed on the semiconductor chip 2 faces a terminal 6 formed on the wiring board 3. The terminal 6 of the wiring board 3 is connected with the bump electrode 4 of the semiconductor chip 2 using a joint part 13 formed by solder in a flip chip method. Nickel plating and palladium plating are sequentially performed on a surface of the terminal 6 of the wiring board 3. The surface of the terminal 6 of the wiring board 3, on which the nickel plating and the palladium plating are sequentially performed, is directly joined to the joint part 13 formed by the solder. |
