发明名称 |
Fluid ejection device comprising substrate contact via |
摘要 |
Edges of a first conductive layer (104) and a silicate glass layer (106) extend adjacent one another along a via (164) extending to a semiconductor substrate (41). An electrical conductor (112/114) extends through the via (164) into contact with the semiconductor substrate (41).
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申请公布号 |
US8476742(B2) |
申请公布日期 |
2013.07.02 |
申请号 |
US20080812776 |
申请日期 |
2008.02.28 |
申请人 |
BURTON GREGORY N.;MIKULAN PAUL I.;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
BURTON GREGORY N.;MIKULAN PAUL I. |
分类号 |
H01L23/485 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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