发明名称 |
PRINTED CIRCUIT BOARDS AND METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS |
摘要 |
<p>A printed circuit board (100) includes a substrate (102) having a first surface (104), a first conductive circuit (110) deposited on the first surface and a dielectric cover (116) deposited on the first surface and covering at least a portion of the first conductive circuit. The dielectric cover has an edge (172) and the first surface is exposed beyond the edge. A second conductive circuit (110) is deposited on the dielectric cover and the substrate. The second conductive circuit spans the edge such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the first surface.</p> |
申请公布号 |
WO2013095922(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
WO2012US67879 |
申请日期 |
2012.12.05 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
MALSTROM, CHARLES RANDALL;LOCONDRO, JOSEPH D.;LAUB, MICHAEL FREDRICK;SARRAF, DAVID BRUCE |
分类号 |
H05K3/46;H05K1/02;H05K3/24 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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