| 摘要 |
<p>Provided is a negative photosensitive resin composition which comprises: (A) an alkali-soluble resin having a carboxylic acid equivalent between 200 g/mol and 1,400 g/mol; (B) a photopolymerization initiator; (C) a polyfunctional monomer; and (D) a zirconium compound. It is possible to provide a negative photosensitive resin composition which has excellent patternability, high UV cured hardness and thermosetting hardness, and high transparency, which provides a cured film having excellent moisture resistance, and which is capable of alkali development.</p> |
