发明名称 TERMINAL LEAD
摘要 A terminal lead 1 includes an inner end portion 1a to be arranged inwardly of an exterior casing 9 which accommodates an electrochemistry element 6, an outer end portion 1b to be arranged outwardly of the exterior casing 9, and a plate-shaped metallic substrate 2 as a base material. An insulating resin film 4 is arranged at a portion of the terminal lead 1 corresponding to a seal portion 9x of the exterior casing 9. In this terminal lead 1, a surface coating layer 3 is formed on both surfaces 2p and 2p of the metallic substrate 2 in a thickness direction thereof. A coated amount of both widthwise end portions 3a and 3a of the surface coating layer 3 formed on both surfaces 2p and 2p of the metallic substrate 2 in the thickness direction is less than that a widthwise intermediate portion 3b thereof.
申请公布号 US2013164613(A1) 申请公布日期 2013.06.27
申请号 US201213723340 申请日期 2012.12.21
申请人 SHOWA DENKO K.K.;SHOWA DENKO PACKAGING CO., LTD.;SHOWA DENKO PACKAGING CO., LTD.;SHOWA DENKO K.K. 发明人 HASHIMOTO DAISUKE;WATANABE TAKUROU;YOKOI KEIICHI;HATA HIROSHI
分类号 H01M2/30;H01G11/74 主分类号 H01M2/30
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