发明名称 WOOD FLOORING MATERIAL AND FLOOR STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a directly sticking wood flooring material excellent in sound insulation and walk feeling. <P>SOLUTION: A directly sticking wood flooring material includes a cushion layer 1, a base material layer 2 made of wood provided on the cushion layer 1, a buffer layer 3 provided on the base material layer 2, and a surface layer 4 provided on the buffer layer 3. The buffer layer 3 consists of a foamed resin whose thickness is smaller than that of the cushion layer 1. The cushion layer 1 consists of a polyurethane foam having a thickness of 1.5-2.5 mm and an expansion ratio of 20-40 or a nonwoven cloth of polyester fiber having thickness of 1.5-2.5 mm and a basis weight of 60-150 g/m<SP POS="POST">2</SP>. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013127170(A) 申请公布日期 2013.06.27
申请号 JP20110276663 申请日期 2011.12.19
申请人 ASAHI WOODTEC CORP 发明人 FUKUDA AKIKO;AOKI YUJI
分类号 E04F15/04;E04F15/18 主分类号 E04F15/04
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