| 摘要 |
<p>A heat bus for cooling electronic devices by transferring heat away from heat producing units to one or more different points on the heat bus, at varying distances from the heat producing units and depending on configuration, from where the heat can be further transported away wherein that said heat bus comprising at least two parallel lamellae and one or more adjustably interconnected structures, said one or more interconnected structures are adapted to be adjustable attached in the gaps between the lamellae, where-by the said one or more interconnected structures can be positioned on or adjacent one or more heat producing units by adjusting the position of the interconnected structures in a plane substantially parallel to the surfaces of the parallel lamellae.</p> |
