| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a control method for the semiconductor manufacturing apparatus capable of suppressing chipping at a wafer edge or cracking of a wafer, for improved productivity. <P>SOLUTION: A wafer transportation arm 1 includes an arm body 21, a wafer sucking arm (hereinafter referred to as a first arm) 22 for sucking and holding a wafer, and a second arm 23 provided to face the first arm 22. At a free end 22a of the first arm 22 and a free end 23a of the second arm 23, two non-contact type sensors 29 including a pair of laser diode 27 and a photodiode 28 are provided. The two non-contact type sensors 29 detect two points of edges of a wafer, to calculate a deviation amount between the center of the wafer and the center of the wafer transportation arm 1. The wafer transportation arm 1 moves to cancel the calculated deviation amount, to transport the wafer to a spin chuck. Thus, centering of the wafer is attained. <P>COPYRIGHT: (C)2013,JPO&INPIT |
