发明名称 |
WAFER-TO-WAFER STACK WITH SUPPORTING POST |
摘要 |
A wafer stack includes: a first wafer having a first substrate and a first device layer having therein at least a chip; a second wafer having a second substrate disposed above the first wafer; and at least a first metal post existing in the first device layer, and arranged between the first and the second substrates, without being electrically connected to the chip.
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申请公布号 |
US2013161829(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
US201313774939 |
申请日期 |
2013.02.22 |
申请人 |
INSITUTE INDUSTRIAL TECHNOLOGY RESEARCH;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHANG CHI-SHIH;TAIN RA-MIN;LIAU SHYI-CHING;LO WEI-CHUNG;LEE RONG-SHEN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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