发明名称 WAFER-TO-WAFER STACK WITH SUPPORTING POST
摘要 A wafer stack includes: a first wafer having a first substrate and a first device layer having therein at least a chip; a second wafer having a second substrate disposed above the first wafer; and at least a first metal post existing in the first device layer, and arranged between the first and the second substrates, without being electrically connected to the chip.
申请公布号 US2013161829(A1) 申请公布日期 2013.06.27
申请号 US201313774939 申请日期 2013.02.22
申请人 INSITUTE INDUSTRIAL TECHNOLOGY RESEARCH;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHANG CHI-SHIH;TAIN RA-MIN;LIAU SHYI-CHING;LO WEI-CHUNG;LEE RONG-SHEN
分类号 H01L23/498 主分类号 H01L23/498
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