MICRO DEVICE HAVING THROUGH SILICON ELECTRODE, METHOD OF MANUFACTURING THE SAME AND MULTI CHIP PACKAGE HAVING THE SAME, AND METHOD OF MANUFACTURING THE MULTI CHIP PACKAGE

摘要

PURPOSE: A semiconductor device having a through electrode, a manufacturing method thereof, a stacked package including thereof, and a manufacturing method of the laminated package are provided to form circuit layers on the top and bottom surfaces of a wafer, thereby enabling one wafer to function as two wafers in a stacked semiconductor package having a less thickness. CONSTITUTION: A wafer(101) has a top surface and a bottom surface. A plurality of circuit layers(110, 115) is each formed on the top surface and the bottom surface. A through electrode(135) passing through the wafer connects electrically the circuit layers that are formed on the top surface and the bottom surface of the wafer.