发明名称 Structure, method and system for complementary strain fill for integrated circuit chips
摘要 A structure, method and system for complementary strain fill for integrated circuit chips. The structure includes a first region of an integrated circuit having multiplicity of n-channel and p-channel field effect transistors (FETs); a first stressed layer over n-channel field effect transistors (NFETs) of the first region, the first stressed layer of a first stress type; a second stressed layer over p-channel field effect transistors (PFETs) of the first region, the second stressed layer of a second stress type, the second stress type opposite from the first stress type; and a second region of the integrated circuit, the second region not containing FETs, the second region containing first sub-regions of the first stressed layer and second sub-regions of the second stressed layer.
申请公布号 US8470674(B2) 申请公布日期 2013.06.25
申请号 US20110983353 申请日期 2011.01.03
申请人 ANDERSON BRENT A.;NOWAK EDWARD J.;RANKIN JED H.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ANDERSON BRENT A.;NOWAK EDWARD J.;RANKIN JED H.
分类号 H01L21/8234;H01L27/118 主分类号 H01L21/8234
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