发明名称 |
METHOD FOR MANUFACTURING PLASTIC METALIZATION THREE-DIMENSIONAL WIRING |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing plastic metalization three-dimensional wiring as a method for manufacturing three-dimensional metalization layout wiring to be formed on a three-dimensional plastic body. <P>SOLUTION: The method for manufacturing plastic metalization three-dimensional wiring includes the steps of: subjecting a plastic body having a 3D structure to a surface pretreatment; then subjecting the resulting body to a metalization treatment for deposition to form a metal thin film layer; then subjecting the resulting body to a photoresist application treatment to form a photoresist protective layer; then subjecting the resulting body to an exposure/lithography treatment to form a patterned photoresist protective layer; then subjecting the exposed metal thin film layer to an etching treatment to form a patterned metal wiring layer; then subjecting the patterned photoresist protective layer to a peeling treatment; and then subjecting the patterned metal wiring layer to a surface layer treatment to form a metal protective layer. In this manner, the method can directly form a circuit pattern having a three-dimensional layout on the plastic body having the 3D structure, and can eliminate the need for separately installing a circuit carrier inside the plastic body, thereby responding to needs of weight saving and compactification. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013125820(A) |
申请公布日期 |
2013.06.24 |
申请号 |
JP20110273104 |
申请日期 |
2011.12.14 |
申请人 |
HU CHUAN-LING;LANTO ELECTRONIC LTD |
发明人 |
HU CHUAN-LING;CAI ZHEN LONG;CHEN YU WEI;ZHANG CHEN HAO |
分类号 |
H05K3/00;C23C18/16;C23C18/30;H05K3/06;H05K3/14;H05K3/18;H05K3/24 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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