| 摘要 |
<p>Various embodiments provide a capacitive micromachined ultrasonic transducer (CMUT) arrangement. The CMUT arrangement may include a substrate including a plurality of trenches formed therein; and a plurality of transducer elements. Each transducer element may include at least one transducer cell, wherein each transducer cell includes a cavity formed above a surface of the substrate and a membrane formed above the cavity. The plurality of trenches are filled with insulating material, and at least one of the plurality of trenches are doped at at least one sidewall.</p> |
