| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition having a short drying time when drying under reduced pressure after applying the curable resin composition on a substrate. <P>SOLUTION: There is provided a curable resin composition which contains a resin having curability and a solvent, wherein the solvent contains a dialkylene glycol dialkyl ether, a solvent (E1) and a solvent (E2), and the content of the dialkylene glycol dialkyl ether is 1 mass% or more and 45 mass% or less based on the total amount of the solvent. The solvent (E1) is different from the dialkylene glycol dialkyl ether and has an evaporation rate of 40 or more and 100 or less when the evaporation rate of butyl acetate is defined as 100. The solvent (E2) is different from the dialkylene glycol dialkyl ether and has an evaporation rate of 13 or more and less than 40 when the evaporation rate of butyl acetate is defined as 100. <P>COPYRIGHT: (C)2013,JPO&INPIT |
