| 摘要 |
A heat dissipation device for a memory card includes a memory slot mounted on a circuit board, a frame, and two fans. The memory slot includes a main body and two fixing portions pivotably mounted to opposite ends of the main body. The frame includes a connection bar abutted against a side surface of the main body, and two plates perpendicularly extending from opposite ends of the connection bar and positioned at opposite ends of the main body. Two hooks protrude from the connection bar respectively adjacent to the two plates to abut against opposite side surfaces of the main body. The fans are respectively fixed to the plates.
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