发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead; forming an interior conductive layer directly on the peripheral lead; forming a vertical connector directly on the interior conductive layer, the vertical connector having a connector top side; connecting an integrated circuit to the interior conductive layer; and forming an encapsulation over the integrated circuit, the encapsulation having an encapsulation top side coplanar with the connector top side.
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申请公布号 |
US2013154120(A1) |
申请公布日期 |
2013.06.20 |
申请号 |
US201113326891 |
申请日期 |
2011.12.15 |
申请人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
发明人 |
DO BYUNG TAI;TRASPORTO ARNEL SENOSA;CHUA LINDA PEI EE |
分类号 |
H01L23/48;H01L21/50;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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