SYSTEM FOR REGULATING THE TEMPERATURE OF AN ASSEMBLY OF ELECTRONIC COMPONENTS OR FOR RECOVERING THE THERMAL ENERGY DISSIPATED BY AN ASSEMBLY OF ELECTRONIC COMPONENTS

摘要

The invention relates to a system for regulating the temperature of printed circuits. It comprises a first assembly containing at least one Peltier element for regulating the temperature of a second assembly containing at least one electronic component or for recovering thermal energy dissipated by said second assembly. At least one Peltier element belonging to the first assembly is coupled to first heat-sink means coupled to at least one electronic component belonging to the second assembly, and to second heat-sink means allowing thermal energy given off by at least one Peltier element of the first assembly to be dissipated.