| 摘要 |
The present invention relates to a circuit pattern inspection device, capable of solving a problem of small inspection signal values and difficult defect judgment due to micro conductive patterns of an inspection object in the circuit pattern inspection device in which electrodes are coupled with the conductive patterns through capacitance in a non contact manner. In the device, an inspection part with two groups of sensor pairs arranged separately is moved, simultaneously, inspection signals composed of AC signals are applied to each conductive pattern through capacitance coupling, furthermore, the inspection signal transmitted to the conductive pattern is detected through the capacitance coupling, inspection signals from each conductive pattern is detected by one movement, the inspection signals are compared with a judgment standard value so as to select defect candidates, the positions of the conductive patterns are ensured to be identical in the inspection signals, the defect candidates are compared one by one, and the conductive patterns in which the defect candidate is arranged at an identical position are judged as imperfect products. |
