| 摘要 |
851,945. Semi-conductor devices. HUGHES AIRCRAFT CO. Oct. 8, 1958 [Nov. 1, 1957], No. 32161/58. Class 37 Apparatus for automatically joining and sealing components of containers, packages, or housing particularly for semi-conductor devices of the type shown in Fig. 1, comprises a stationary support carrying one portion of the container to be sealed a movable support carrying further components of said container and movable chamber forming means disposed between said supports such that when the movable support is moved to bring the portions of the container into assembly position, the chamber forming means forms, between the two supports, a chamber in which a predetermined atmosphere may be established. Fig. 2 shows the preferred form of the apparatus in its open condition in which 31 is the fixed support 42 the movable support and 51 the chamber forming means. Fig. 3 shows a vertical section through the apparatus in its closed position. In operation the components of the diode, Fig. 1, are initially assembled into two sub-assemblies one comprising tubular envelope 21, with glass bead 19, lead-in wire 15 and junction 5, 3 and 13 while glass bead 17 with lead-in wire 9 and contact 7 form the other. The first of these sub-assemblies is placed in recess 33 in block 31 shown in Fig. 3, of the apparatus in its open position, shown in Fig. 2, the second sub-assembly is held by its lead-wire of copper sheathed nickel iron alloy in a groove 41 in magnet 44. The recess 33 and groove 74 being aligned so that in the closed position, shown in Fig. 3, the sub-assemblies are held in their final assembled position, the correct contact pressure being obtained by means of arm 76 pivoted about point 77 and having adjustable counterbalance 79, bearing on the bottom of lead wire 15. The required atmosphere is then introduced into the chamber formed by member 51, through connector 101 and passage 80, and current is passed through heating coil 32, arranged around the diode, in order to fuse glass bead 17 to tube 21, and so complete assembly of the diode. In order to make assembly of the components of the diode into the apparatus easier a further embodiment is described in which the heating coil is attached to member 51 so it is lifted out of the way when the apparatus is in its open condition. |
