| 摘要 |
PURPOSE: A semiconductor manufacturing processing test method are provided to immediately recognize an exposure pattern profile failure through a test equipment such as SEM, thereby performing the exposure process rework in the minimum damage state. CONSTITUTION: A semiconductor image which is obtained by photographing the semiconductor with a camera is transmitted to a management server through the communication network(S410). The management server compares a standard image with the semiconductor image and determines the similarity of the standard image and the semiconductor image(S420). The management server, in case of being determined that a problem has generated, transmits a message which informs the problem in a manufacturing process(S430). The management server transmits a command which stops the semiconductor manufacturing process(S440). A test apparatus outputs a warning which informs the generation of problem in the manufacturing process and outputs the warning alarm(S450). [Reference numerals] (AA) Test apparatus; (BB) Management server; (CC) User terminal; (S410) Transmit a semiconductor image after obtaining the semiconductor image by photographing the semiconductor through a camera; (S420) Determine similarity between a reference image and the semiconductor image by comparing them; (S430) Transmit a message which informs a problem in a manufacturing process in case there is an error; (S440) Transmit a command which stops a semiconductor manufacturing process; (S450) Display a warning which informs the generation of the problem in the manufacturing process and output the warning alarm
|
