| 摘要 |
PURPOSE: A connection structure of LED package arrays is provided to allow the other LED packages except one faulty LED package to work normally, thereby improving reliability of product. CONSTITUTION: One or more chips constitute one LED package, and a plurality of LED packages is connected to each other in parallel so as to constitute one block. An LED package array is formed by connecting a plurality of blocks in series. A plurality of LED packages is mounted on a PCB by surface mounting method. A dam is formed around the plurality of LED packages on the PCB. [Reference numerals] (AA) Block 1; (BB) Block 2; (CC) Block 30 |
