发明名称 |
Solder bump confinement system for an integrated circuit package |
摘要 |
A solder bump confinement system is provided includes a substrate; a contact material patterned on the substrate; an inner passivation layer deposited over the contact material and the substrate; an under bump material pad over the contact material; an under bump material defining layer, having a bump opening contained therein, directly on the under bump material pad in which the under bump material defining layer has a thickness in the range of 200 Angstrom to 1500 Angstrom; and a system interconnect formed over the contact material and coupled to the under bump material defining layer and the under bump material pad through the bump opening.
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申请公布号 |
US8466557(B2) |
申请公布日期 |
2013.06.18 |
申请号 |
US20100756067 |
申请日期 |
2010.04.07 |
申请人 |
LIN YAOJIAN;MARIMUTHU PANDI CHELVAM;PENDSE RAJENDRA D.;STATS CHIPPAC LTD. |
发明人 |
LIN YAOJIAN;MARIMUTHU PANDI CHELVAM;PENDSE RAJENDRA D. |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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