发明名称 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
摘要 A semiconductor device may include an interlayer insulating layer containing hydrogen and a first passivation layer configured to prevent or inhibit an out-gassing of the hydrogen. In the method, a second passivation layer configured to control a warpage characteristic of a wafer may be formed on the first passivation layer.
申请公布号 US2013147022(A1) 申请公布日期 2013.06.13
申请号 US201213706960 申请日期 2012.12.06
申请人 SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. 发明人 YOON JUNG-SOO;HONG JONGWON;PARK INSUN;LEE JONGMYEONG;CHOI SEUNG-WOOK
分类号 H01L29/06 主分类号 H01L29/06
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