发明名称 |
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME |
摘要 |
A semiconductor device may include an interlayer insulating layer containing hydrogen and a first passivation layer configured to prevent or inhibit an out-gassing of the hydrogen. In the method, a second passivation layer configured to control a warpage characteristic of a wafer may be formed on the first passivation layer.
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申请公布号 |
US2013147022(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
US201213706960 |
申请日期 |
2012.12.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOON JUNG-SOO;HONG JONGWON;PARK INSUN;LEE JONGMYEONG;CHOI SEUNG-WOOK |
分类号 |
H01L29/06 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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