发明名称 |
HEAT SPREADER FOR MULTIPLE CHIP SYSTEMS |
摘要 |
Various heat spreaders and methods of making and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a heat spreader that has a surface adapted to establish thermal contact with a first semiconductor chip and a second semiconductor chip on a substrate. The surface includes a first portion adapted to thermally contact a solder-based thermal interface material and a second portion having an opening adapted to hold an organic thermal interface material.
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申请公布号 |
US2013147028(A1) |
申请公布日期 |
2013.06.13 |
申请号 |
US201113313584 |
申请日期 |
2011.12.07 |
申请人 |
SU MICHAEL Z.;BLACK BRYAN;REFAI-AHMED GAMAL |
发明人 |
SU MICHAEL Z.;BLACK BRYAN;REFAI-AHMED GAMAL |
分类号 |
H01L23/34;H01L21/50 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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