<p>Disclosed is an integrated circuit die comprising an active substrate (20) including a plurality of components laterally separated from each other by respective isolation structures (30), at least some of the isolation structures carrying a further component (40), wherein the respective portions of the active substrate underneath the isolation structures carrying said further components are electrically insulated from said components. A method of manufacturing such an IC die is also disclosed.</p>
申请公布号
EP2602817(A1)
申请公布日期
2013.06.12
申请号
EP20110191998
申请日期
2011.12.05
申请人
NXP B.V.
发明人
BOLT, MICHAEL JOHN BEN;DUBOIS, JEROME GUILLAUME ANNA;AGRAWAL, NAVEEN;BISHT, GAURAV SINGH;THILLAIGOVINDAN, JAYARAJ;JIE, LIAO;LIM, KHIN HOONG;BERCKMANS, NICO;WESSELS, PETRUS JACOBUS JOHANNES