Polishing slurry and polishing material using same
摘要
Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).
申请公布号
US8460414(B2)
申请公布日期
2013.06.11
申请号
US20060918226
申请日期
2006.04.14
申请人
ETOH AKINORI;OIKE SETSUKO;ISHIZUKA TOMOKAZU;FUJII SHIGEHARU;SHINDO KIYOTAKA;MITSUI CHEMICALS, INC.
