发明名称 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To mount a component fast. <P>SOLUTION: The component mounting device includes a conveyance device 400 which has a holding mechanism 120 for holding a supplied component 30, and conveys the component 30 to a mounted member 20, and a coating device 600 which coats the component 30 held by the holding mechanism 120 with an adhesive. Consequently, the component 30 coated with the adhesive is mounted on the mounted member 20 fast before the adhesive is dried. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013115309(A) 申请公布日期 2013.06.10
申请号 JP20110261679 申请日期 2011.11.30
申请人 AKIM KK 发明人 MOMOSE KAZUHISA
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址