发明名称 SUBSTRATE, MANUFACTURING METHOD THEREOF AND INKJET PRINT HEAD
摘要 PURPOSE: A silicon substrate, a manufacturing method thereof, and an inkjet print head are provided to enable to remove a faulty etch profile portion generated in a dry etching process of the silicon substrate and to improve a shape of an ink flow path. CONSTITUTION: A silicon substrate(200) comprises a first connection unit(210), a second connection unit(220), and a restrictor unit(230). The first connection unit is connected to a manifold and has the first width(W1) of first size. The second connection unit is connected to a pressure chamber and has the second width(W2) of second size. The restrictor unit connects the first and second connection units and has the third width(W3) of third size smaller than the first or the second size. Boundary portions(250,252), where the restrictor unit and the first connection unit or the restrictor unit and the second connection unit are connected, are formed into a curved shape.
申请公布号 KR20130060500(A) 申请公布日期 2013.06.10
申请号 KR20110126591 申请日期 2011.11.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JAE CHANG;LEE, TAE KYUNG;LEE, HWA SUN;KIM, SUNG WOOK
分类号 B41J2/16;B41J2/175 主分类号 B41J2/16
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