| 摘要 |
PURPOSE: A manufacturing method of a flexible electronic device using a reinforcing substrate, the flexible electronic device, and a flexible substrate are provided to arrange the electronic device on a separation surface which has the same surface roughness of a motherboard, thereby easily solving a surface roughness problem of a metal flexible substrate. CONSTITUTION: A manufacturing method of a flexible electronic device using a reinforcing substrate(400) is comprised of the following steps. A flexible substrate(200) is formed on a motherboard(100). The flexible substrate is attached on the reinforcing substrate. The flexible substrate is separated from the motherboard. The electronic device is formed on a separation surface of the flexible substrate. |
