| 摘要 |
<p>A method of mounting in which electric parts of different mounting systems can be efficiently mounted with an adhesive. There is provided a method of mounting an electric part on glass substrate (1) with the use of thermocompression bonding head (7) including head main body (8) and, disposed thereon, compression bonding member (9) of given elastomer. This method comprises the step of arranging anisotropic conductive adhesive film (4) on the entire surface of mounting region (3) of the upper surface of glass substrate (1), thereafter superimposing electric parts of different mounting systems on the mounting region (3) and carrying out collective thermocompression bonding of the electric parts by the use of compression bonding member (9) with a size corresponding to that of the anisotropic conductive adhesive film (4). COG system IC chip (5) and FOG system flexible printed wiring board (6) can be appropriately used as the electric parts.</p> |
