发明名称 ELECTRONIC BOARD CONTAINING DEVICE AND ELECTRONIC APPARATUS
摘要 An electronic board (200A) incorporates a heat generating element (220). A housing (300A) hermetically contains the electronic board (200). A cooling unit (400) cools the electronic board (200). The cooling unit (400) comprises a heat receiving unit (410) and a heat radiating unit (420). The heat receiving unit (410) receives a heat from the electronic board (200). The heat radiating unit (420), which is coupled to the heat receiving unit (410), radiates the heat that has been received by the heat receiving unit (410) from the electronic board (200). The heat receiving unit (410) is hermetically disposed inside the housing (300A), while the heat radiating unit (420) is disposed outside the housing (300). In this way, an efficient cooling can be achieved, and further, maintenance and replacement can be done for each individual electronic board containing device.
申请公布号 WO2013080897(A1) 申请公布日期 2013.06.06
申请号 WO2012JP80402 申请日期 2012.11.16
申请人 NEC CORPORATION;YOSHIKAWA, MINORU;SAKAMOTO, HITOSHI;CHIBA, MASAKI;INABA, KENICHI;MATSUNAGA, ARIHIRO 发明人 YOSHIKAWA, MINORU;SAKAMOTO, HITOSHI;CHIBA, MASAKI;INABA, KENICHI;MATSUNAGA, ARIHIRO
分类号 H05K7/20;H05K7/18 主分类号 H05K7/20
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