摘要 |
An electronic board (200A) incorporates a heat generating element (220). A housing (300A) hermetically contains the electronic board (200). A cooling unit (400) cools the electronic board (200). The cooling unit (400) comprises a heat receiving unit (410) and a heat radiating unit (420). The heat receiving unit (410) receives a heat from the electronic board (200). The heat radiating unit (420), which is coupled to the heat receiving unit (410), radiates the heat that has been received by the heat receiving unit (410) from the electronic board (200). The heat receiving unit (410) is hermetically disposed inside the housing (300A), while the heat radiating unit (420) is disposed outside the housing (300). In this way, an efficient cooling can be achieved, and further, maintenance and replacement can be done for each individual electronic board containing device. |
申请人 |
NEC CORPORATION;YOSHIKAWA, MINORU;SAKAMOTO, HITOSHI;CHIBA, MASAKI;INABA, KENICHI;MATSUNAGA, ARIHIRO |
发明人 |
YOSHIKAWA, MINORU;SAKAMOTO, HITOSHI;CHIBA, MASAKI;INABA, KENICHI;MATSUNAGA, ARIHIRO |