| 摘要 |
Provided is an insulating material which uses an epoxy resin composition that has excellent dielectric characteristics and practical characteristics at the same time, said insulating material being suitable for use as an interlayer insulating material for multilayer printed wiring boards. The present invention is an insulating material which is obtained using an epoxy resin composition that contains, as an epoxy resin curing agent, 50-100 wt% of a polycondensation type aryloxysilane compound that has a hydroxyl equivalent weight within the range of 1,000-8,000 g/eq, said epoxy resin composition also containing an epoxy resin that has an epoxy equivalent weight of 200-500. A thermally cured product obtained by curing this epoxy resin composition at a temperature of 180°C or less has a dielectric constant of 3.00 or less and a dielectric loss tangent of 0.015 or less at 1 GHz at room temperature. |
