| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive paste composition that is excellent in the mechanical strength, the heat resistance, the humidity resistance, the flexibility, the thermal cycle resistance, the solder reflow resistance, the dimension stability and the like after hardening, and that shows a high adhesion reliability and a high conduction reliability if used as a conduction material. <P>SOLUTION: A conductive paste composition contains (A) epoxy resin, (B) polyvinyl acetal resin, (C) rosin derivative, (D) epoxy resin hardener, and (E) metal fine particles having a center particle diameter of 10 nm to 30 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
