| 摘要 |
[Problem] To provide a gold-platinum-palladium alloy bonding wire for vehicle-mounted semiconductors, which exhibits excellent reliability in the connection with aluminum pads, while being highly reliable when left at high temperatures even in cases where an epoxy resin containing no halogen substance is used, thereby capable of maintaining the electrical characteristics after being left at high temperatures. [Solution] A gold-platinum-palladium alloy bonding wire which contains 0.4-1.2% by mass of platinum, 0.01-0.5% by mass of palladium, 10-30 ppm by mass of aluminum and 10-60 ppm by mass of calcium and/or magnesium in total, with the balance made up of gold having a purity of 99.999% by mass or more. |
