SEMICONDUCTOR PACKAGES FOR A MOBILE DEVICE

摘要

PURPOSE: A semiconductor packages for a mobile device is provided to improve the cooling efficiency of a chip by quickly discharging the heat from an IC chip by forced air circulation. CONSTITUTION: A line substrate includes an upper conductive line(111) and a conductive line(110) having a lower conductive line(112). An IC chip(200) is arranged in the upper surface of the line substrate and electrically connected to the conductive line. A cover part(300) provides a space for flowing air around an IC chip. The cover part includes an opening(310,320) connected to the space. A flow generator(400) forcibly circulates the air passing a first opening, a second opening, and the space.