发明名称 |
TSVs with different sizes in interposers for bonding dies |
摘要 |
A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs.
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申请公布号 |
US8455995(B2) |
申请公布日期 |
2013.06.04 |
申请号 |
US20100762085 |
申请日期 |
2010.04.16 |
申请人 |
TSAI PO-HAO;LIN JING-CHENG;YU CHEN-HUA;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI PO-HAO;LIN JING-CHENG;YU CHEN-HUA |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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